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分类：探针卡间距: 80 um 特点: MEMS -Like Characteristics, Available in both flat and pointed tip, Leave smaller probe mark on the DUT, Ideal for pitch above 80 um, Force 50% Lower than Conventional Buckling Team, C.C.C 40% Higher than Conventional Buckling Team, Longer Lifetime benefi -
分类：探针卡特点: Pogo pin Manufactured with MEMS Process, Customized force to fit Special testing condition, Easy Maintenance and single pin replacement, Comfortable with MPI in-house substrates -
分类：探针卡间距: 80 um 特点: MEMS wire needle for Cu Pillar bump probing, Applicable for full array and multi-DUT layout, Extreme low force below 2.2 gf, Ideal for pitch above 80 um, wire type needle for easy maintenance, Applicable for auto assembly -
分类：探针卡间距: 40 um 特点: Ideal for device pitch down to 40 um, Suitable for tiny pad size down to 35 um, forming wire needle for simplistics maintenance process, Needle Coating by MEMS process, Compatible with MPI in-house substrates -
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特点: Best suited to flip chip wafer testing of microprocessors and SoC devices -
应用: WLCSP 特点: Best suited to one-touchdown testing of 12-inch wafers (NAND Flash) as well as WLCSP applications -
特点: Suitable formuli-die test, including peripheral pad layout, Best suited to measuring higher density, higher speed logic and SoC devices