T H Lee The Design of Radio-Frequency CMOS Circuits【参数，厂家，图片，选型】-射频网

PH Series

美国

分类：探针卡

厂商：FormFactor Inc.

间距: 50 um 特点: 3D MEMS MicroSpring contact design with high pin count and small pad size capability, Wide temperature compatibility for more controlled probing and faster setup, higher probe card availability and better test throughput, Scalability to 50 um pad pitch, I 探头尺寸: 50 mm to 100 mm

Katana-RF

美国

分类：探针卡

厂商：FormFactor Inc.

间距: 80 to 106 um 特点: Measurement accuracy, Excellent signal integrity, Minimum contact resistance, Repeatable results, High test efficiency, Straightforward cleaning and maintenance Minimum pad damage, Minimum contact force, Easily replaceable probes, Lower cost of test, Long 频率: up to 45 GHz 直流电流: 0.8 to 10 A 隔离: 30 dB

Katana

美国

分类：探针卡

厂商：FormFactor Inc.

应用: Micro controllers, logic IC’s, automotive IC’s, touchscreen controllers & sensor IC’s 特点: Designed for pad testing of either fine-pitch wire-bond devices or pre-flip chip applications of logic devices 工作温度: -40 to 140 Degree C

Cantilever

美国

分类：探针卡

厂商：FormFactor Inc.

间距: 40 um 特点: Supports 40 um pitch, 20/40 um staggered design, Short-beam option for high speed testing, up to 3 GHz @-3 dB, Uniform scrub performance for improved wire bond reliability

Apollo

美国

分类：探针卡

厂商：FormFactor Inc.

间距: 80 um 特点: Broad range of vertical and vertical MEMS probe options, scalable to 80 um pitch, Proprietary manufacturing technology for reduced Cres and improved wafer yield, Superior current-carrying capability for enhanced production uptime and quick time-to-market

Altius

美国

分类：探针卡

厂商：FormFactor Inc.

间距: 45 um 应用: Cloud computing and Self-Driving Automobiles 特点: Minimum grid-array pitch of 45 µm, Ultra-low probe force for direct probing on copper through silicon vias or solder microbumps, ~1 gram per probe at operating overtravel with best-in-class contact resistance stability, Support for HBM known-good-die or k