TrueScale

参数

• 间距 / Pitch : 50 um
• 特点 / Features : Support for single-row pad layout down to 50 um pitch, Excellent positional accuracy over more than 1 million touchdowns, Minimization of false test failures Wire bond pad probing, minimum in-line pitch of 50 µm, Supports high multi-site testing, scalable
• 晶片尺寸 / Wafer Size : 300 mm

厂家介绍