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分类：探针台和系统卡盘尺寸: 150 mm Chuck Planarity: ±3 µm 查克-西塔粗旅行: ±360 Degrees 卡盘行程范围: 152.4 x 152.4 mm Chuck Z 精确分辨率: 1 µm -
分类：探针台和系统卡盘尺寸: 150 mm Chuck Planarity: ±3 µm 查克-西塔粗旅行: ±360 Degrees Chuck Theta 精细分辨率: ±0.01 Degree 卡盘行程范围: 152.4 x 152.4 mm -
卡盘尺寸: 200 mm Chuck Planarity: ±10 um 查克-西塔粗旅行: ±7.5 Degree 卡盘行程范围: 203 x 203 mm 查克旅行决议: 0.2 µm -
卡盘尺寸: 200 mm Chuck Planarity: ±10 um 查克-西塔粗旅行: ±5.5 to 5.7 Degrees 卡盘行程范围: 203 x 203 mm 查克旅行决议: 1 µm -
卡盘尺寸: 200 mm 查克-西塔粗旅行: ±6 Degree 卡盘行程范围: 200 x 200 mm 查克旅行决议: 1 µm 频率: DC to 1 KHz -
卡盘尺寸: 300 mm Chuck Planarity: ±8 µm 查克-西塔粗旅行: ±8 Degrees 卡盘行程范围: 300 x 300 mm 直径: 300 mm -
卡盘尺寸: 200 mm Chuck Planarity: ±10 um 卡盘行程范围: 205 x 205 mm 查克旅行决议: 0.5 µm 材料: Aluminum -
卡盘尺寸: 150 mm Chuck Planarity: ±10 um 查克-西塔粗旅行: ±360 Degrees Chuck Theta 精细分辨率: ± 8 Degree 卡盘行程范围: 155 x 155 mm -
卡盘尺寸: 200 mm 频率: 40 to 67 GHz 测量类型: RF 显微镜眼罩: 20x 显微镜放大范围: 150x -
卡盘尺寸: 200 mm Chuck Planarity: ±3 µm 卡盘行程范围: 200 mm 频率: Up to 110 GHz 测量类型: RF -
卡盘尺寸: 300 mm 查克-西塔粗旅行: ±3.75 Degrees 卡盘行程范围: 301 x 501 mm 查克旅行决议: 0.2 µm 直径: 305 mm -
卡盘尺寸: 300 mm 查克-西塔粗旅行: ±3.75 Degrees 卡盘行程范围: 301 x 501 mm 查克旅行决议: 0.2 µm 频率: DC to 2.5 Hz -
卡盘尺寸: 300 mm 查克-西塔粗旅行: ±3.75 Degrees 卡盘行程范围: 301 x 501 mm 查克旅行决议: 0.2 µm 频率: DC to 2.5 Hz -
频率: Upto 500 GHz 类型: Automatic 应用: 5G, Test & Measurement, Autonomous driving and Wi-Fi -
频率: 170 to 220 GHz 类型: Automatic 类型: Manual 应用: 5G, 6G 工作温度: -60 to 125 Degree C -
卡盘尺寸: 11 to 200 mm Chuck Planarity: ±10 um 卡盘行程范围: 11 to 200 mm 材料: Stainless Steel 测量类型: DC -
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分类：探针卡间距: 80 um 特点: MEMS wire needle for Cu Pillar bump probing, Applicable for full array and multi-DUT layout, Extreme low force below 2.2 gf, Ideal for pitch above 80 um, wire type needle for easy maintenance, Applicable for auto assembly -
分类：探针卡间距: 40 um 特点: Ideal for device pitch down to 40 um, Suitable for tiny pad size down to 35 um, forming wire needle for simplistics maintenance process, Needle Coating by MEMS process, Compatible with MPI in-house substrates -
分类：探针卡间距: 80 um 特点: MEMS -Like Characteristics, Available in both flat and pointed tip, Leave smaller probe mark on the DUT, Ideal for pitch above 80 um, Force 50% Lower than Conventional Buckling Team, C.C.C 40% Higher than Conventional Buckling Team, Longer Lifetime benefi